ORIGINAL ARTICLE |
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Year : 2015 | Volume
: 18
| Issue : 5 | Page : 379-383 |
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Micro-tensile bond strength of different adhesive systems on sound dentin and resin-based composite: An in-vitro study
Rashmirekha Mallick1, Priyanka Sarangi1, Sandhyarani Mohanty1, Subasish Behera1, Soumyaranjan Nanda1, Sukanta Kumar Satapathy2
1 Department of Conservative Dentistry and Endodontics, SCB Dental College and Hospital, Cuttack, Odisha, India 2 Department of Prosthodontics, SCB Dental College and Hospital, Cuttack, Odisha, India
Correspondence Address:
Dr. Priyanka Sarangi Department of Conservative Dentistry and Endodontics, SCB Dental College and Hospital, Cuttack, Odisha India
 Source of Support: None, Conflict of Interest: None  | Check |
DOI: 10.4103/0972-0707.164036
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Aim: To analyze the difference in the micro-tensile bond strength of specimens made with two different adhesive systems and compare them with two homogenous substrates.
Materials and Methods: Sixty permanent mandibular molars were mounted in acrylic blocks and sectioned with exposed dentin surfaces. Samples were then divided into four groups. To Group-I Adper Single Bond 2 and to Group-II Adper Self-Etch plus bonding agents were applied. For Group-I and Group-II beams consisted of resin composite in the upper half and dentin in the lower half. In Group-III beams were made of only dentin. In Group-IV beams were made of only composite. Fifteen specimens of each group were taken for the micro-tensile bond strength test.
Statistical Analysis: The results are analyzed using one-way analysis of variance and Critical Difference test.
Results: The interface bonded with the two adhesive systems had lower micro-tensile bond strength than those of dentin and resin composite and the self-etching adhesive Adper Self-Etch plus had comparable bond strength with total-etch adhesive Adper Single Bond 2.
Conclusion: The bond strength values for current adhesive systems cannot be compared to the micro-tensile bond strength of dentin and resin composite, and self-etching adhesives have comparable bond strength with total-etch adhesives. |
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